Super Micro Computer has introduced a new line of racks designed for high-density AI data centre deployments, aiming to speed up installation and integration.
The company said its extended range is intended for mission-critical workloads.
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It supports the latest standards, including Open Rack v3 (ORv3), which enables easier integration of liquid cooling solutions and may help reduce total cost of ownership.
The racks are factory pre-assembled, tested for shock and vibration, and supplied in crates to streamline deployment and eliminate complex integration steps.
Super Micro Computer president and CEO Charles Liang said: “AI infrastructure starts with the right foundation, and our purpose-built rack portfolio is engineered to accelerate every stage of deployment. As a key component of our DCBBS technologies, these high-density, liquid-cooling-optimised racks enable customers to deploy AI clusters faster, maximise compute density, improve reliability, and reduce total cost of ownership.
“Our manufacturing scale enables us to deliver up to 3,000 of these advanced racks per month, including 2,000 liquid-cooled racks from our facilities around the world for immediate deployment into existing and new data centres. The racks are Plug-and-Play ready for immediate installation in the customers data centre.”
The company said that its in-house engineering uses a reinforced chassis capable of supporting up to 2,500 kg, which exceeds typical industry standards.
The racks are designed to accommodate the weight of GPU-accelerated systems, liquid cooling units, and power equipment. Quality control includes seismic and vibration testing based on GR-63-CORE Zone 4 standards.
Super Micro Computer’s racks are intended for integration with various cooling and power delivery systems, including in-rack and in-row cooling distribution units, sidecars, rear-door heat exchangers, and liquid cooling manifolds.
The racks come in several variants, ranging from 19-inch and 21-inch to multiple heights. They are available from manufacturing sites in Silicon Valley, the Netherlands, and Taiwan.
Super Micro Computer earlier broadened its Data Center Building Block Solutions (DCBBS) portfolio with Rear Door Heat Exchanger (RDHx) products, offering additional liquid cooling solutions for high-density AI and high-performance computing (HPC) data centres.
