Super Micro Computer has broadened its Data Center Building Block Solutions (DCBBS) portfolio with Rear Door Heat Exchanger (RDHx) products, offering additional liquid cooling solutions for high-density AI and high-performance computing (HPC) data centres.

The company says the enhanced RDHx lineup can be implemented in both new deployments and existing data centre facilities.

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The expanded range is aimed at providing flexible liquid cooling options that support standard electronic industries alliance (EIA), open rack version 3 (ORv3), and MGX racks.

Super Micro indicated that the ten new RDHx models can serve as primary cooling systems or be integrated with its direct-to-chip (D2C) technologies.

This approach enables customers to develop rack-scale cooling configurations tailored to specific site requirements, hardware constraints, and compute workloads.

Super Micro president and CEO Charles Liang said: “We continue to expand our DCBBS offerings to provide our customers with unmatched customisation and optimisation options.

“Our expanded RDHx portfolio helps customers realise the benefits of liquid cooling, with a range from 10kW up to 120kW of cooling at the door level, with a max of 240kW of cooling capacity at the rack-level, enabling more efficient data centre operations.”

The RDHx systems are designed to be mounted directly to compatible racks, allowing rapid deployment and eliminating the need for major facility modifications or dedicated chilled water infrastructure.

These new models incorporate features such as intelligent fan control, redundancy, anti-condensation protection, and provide real-time monitoring of operational metrics via Redfish, SNMP, web-based management, and Supermicro SuperCloud Composer.

The company positions its DCBBS as a modular foundation for building AI infrastructure from individual servers to full rack-scale systems, including required software and services.