LG Electronics has received official certification from Nvidia for its 600kW Coolant Distribution Unit (CDU), following evaluation criteria that assess reliability, performance, and failover capability in AI data centre environments.

The certification was awarded after LG’s CDU met more than 100 technical benchmarks, supporting standardisation for AI Factory infrastructure and offering assurance to global data centre operators on solution quality.

Access deeper industry intelligence

Experience unmatched clarity with a single platform that combines unique data, AI, and human expertise.

Find out more

The recognition establishes LG Electronics as an officially verified Nvidia partner for AI Factory cooling infrastructure, a status that the company states may reduce procurement risks for operators considering high-density AI deployments worldwide.

According to LG, its 600kW CDU uses a Direct-to-Chip (DTC) liquid cooling system, which supplies coolant directly to heat-producing components such as graphics processing units (GPUs) and central processing units (CPUs) while working alongside existing air-cooling set-ups.

The CDU is engineered to maintain temperature stability within ±0.25 degrees Celsius.

The system also features integrated virtual sensors for real-time monitoring and leak detection, and can connect with centralised management systems using standard communication protocols.

Testing for the CDU took place at LG’s Chip-to-Chiller validation facility in Pyeongtaek, with evaluations covering system responsiveness, temperature changes, and operational stability throughout the full cooling chain, from the chip to the chiller.

LG also pairs the CDU with its Data Center Cooling Control Manager (DCCM) to offer predictive control and centralised monitoring capabilities.

The company reports that its certification by Nvidia is the initial step in a broader strategy to expand its AI data centre business, with plans to seek additional certifications for larger capacity CDUs, including models up to 4MW.

LG Electronics notes its experience in producing key heating, ventilation and air conditioning (HVAC) components in-house, such as inverter systems and magnetic bearing compressors.

The company also highlights recent contracts for data centre cooling at hyperscaler sites in North America and the SM+ Data Center in Jakarta, Indonesia.

LG ES company president James Lee said: “As AI data centres continue to scale, the need for highly reliable liquid cooling solutions has never been greater.

“Leveraging our advanced cooling technologies together with the LG Group’s integrated infrastructure capabilities, we are expanding our AI infrastructure business with end-to-end solutions that help enable Physical AI, where AI creates value in real-world environments.”