Molex has announced an investment in CAEPlus, a company specialising in active liquid cooling technology for data centres handling AI and high-performance computing (HPC) workloads.
The investment is aimed at further developing CAEPlus’ BoundaryCool platform.
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This technology is designed to address increasing thermal management challenges within next-generation graphics processing unit (GPU) and application-specific integrated circuit (ASIC)-based data centre environments.
The collaboration will accelerate the development and validation of active cooling solutions that can improve heat transfer performance in liquid-cooled systems while maintaining compatibility with existing data centre architectures.
Molex copper solutions business vice-president and general manager Jairo Guerrero said: “Advanced thermal management is becoming a critical enabler for the next wave of compute performance.
“Our strategic investment in CAEPlus reflects Molex’s commitment to supporting innovations in liquid cooling while working with emerging technology leaders to help customers address rapidly evolving AI and compute-intensive data centre requirements.”
CAEPlus’ BoundaryCool platform features an active cooling architecture that offers significantly higher heat transfer and greater reductions in central processing unit (CPU), GPU, and tensor processing unit (TPU) chip temperatures in comparison to passive cold plate technologies.
CAEPlus founder and CEO Milad Bashirzadeh: “CAEPlus was founded to address the rapid pace of change in data centre cooling requirements by enabling an entirely new class of active liquid cooling solutions.
“In addition to its investment, Molex brings deep engineering expertise and a strong track record of helping scale innovative technologies.
“We are excited to work together in advancing our proprietary cooling technology and meet unrelenting industry requirements for higher levels of performance and efficiency.”
Molex will retain exclusive licensing to incorporate CAEPlus technology into its range of pluggable input/output (I/O) solutions as part of the agreement.
Financial terms of the investment were not disclosed.
